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TCD1254GFG rev. 3.0 2009-01-15 1 toshiba ccd image sensor ccd (charge coupled device) TCD1254GFG the TCD1254GFG is a high sensitive and low dark current 2500-elements linear image sensor. this device consists of sensitivity ccd chip. the TCD1254GFG has electronic shutter function (icg). electronic shutter function ca n keep always output voltage constant that vary with intensity of lights. features ? number of image sensing elements: 2500 elements ? image sensing element size: 5.25 m 64 m ? photo sensing region: high se nsitive and low dark current pn photodiode ? internal circuit: ccd drive circuit ? power supply: only 3.0v drive (min.) ? function: electronics shutter, sample and hold circuit ? package: 16 pin glcc package maximum ratings (note1) characteristic symbol rating unit master clock pulse voltage v ? shift pulse voltage v sh icg pulse voltage v icg digital power supply v dd analog power supply v ad ? 0.3~7.0 v operating temperature t opr ?25 ~60 c storage temperature t stg ?40 ~85 c note 1: all voltage is with respect to ss terminals (ground). weight: 0.47 g (typ.) pin connections (top view) nc 16 15 os 1 2 3 ss 10 9 8 nc 14 nc vad nc nc 4 nc nc 11 13 12 5 6 nc ? vdd icg sh 7nc pin connections (top view) free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 2 block diagram pin names pin no. symbol name pin no. symbol name 1 os output signal 16 nc non connection 2 ss ground 15 nc non connection 3 vad power (analog) 14 nc non connection 4 vdd power (digital) 13 nc non connection 5 m master clock 12 nc non connection 6 icg integration clear gate 11 nc non connection 7 sh shift gate 10 nc non connection 8 nc non connection 9 nc non connection ccd analog shift register 2 ccd analog shift register 1 vdd os 3 vad shift gate 2 d16 d17 d18 d19 d30 d31 s1 s2 photo diode s2499 s2500 d32 d33 d44 d45 shift gate 1 integration clear gate 1 signal output buffer 1 4 5 7 m ss sh icg 6 2 integration clear gate 2 logic circuit free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 3 optical/electrical characteristics (ta = 25c, v = 4.0v (pulse), f ? = 2.0 mhz (data rate=1mhz), tint(integration time) = 10ms, load resistance = 100 k , vad = vdd = 4.0v, light source = daylight fluorescent lamp) characteristics symbol min typ. max unit note sensitivity r 72 103 ? v/lx ? s (note2) photo response non uniformity prnu ? ? 10 % (note3) register imbalance ri ? 1.5 3 % (note4) saturation output voltage v sat 0.7 1.0 ? v (note5) saturation exposure se ? 0.01 ? lx ? s (note6) dark signal voltage v mdk ? 2.5 15 mv (note7) dc power dissipation pd ? 24 60 mw total transfer efficiency tte 92 95 ? % (note 8) 92 95 ? % (note 9) low voltage total transfer efficiency lvtte 83 88 ? % (note 10) output impedance z o 0.5 1.0 ? dc output voltage v os 1.5 2.3 3.0 v (note 11) dynamic range dr ? 400 ? ? (note 12) note 2: sensitivity is defined for signal outputs when t he photosensitive surface is applied with the light of uniform illumination and uniform color temperature. note 3: prnu is defined for a single chip by the expressi ons below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. x prnu = x 100(%) where x is average of total signal output and x is the maximum deviation from x . the amount of incident light is 1/2 ? se. note 4: register imbalance is defined as follows. y ri = x 100(%) where x is average of total signal output. y : | average of odd signal output ? average of even signal output | note 5: v sat is defined as minimum saturation output of all effective pixels. note 6: definition of se v sat se = r (lx ? s) note 7: v mdk is defined as maximum dark signal voltage of all effective pixels. v mdk os free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 4 note 8: total transfer efficiency is defined as follow. * q0=500mv average of dummy outputs use q0? and q1? instead of q0 and q1 if q1? > q1. note 9: definition of low voltage total transfer effi ciency is same as note 8 without power supply and q0. * 4v Q power supply Q 5 v * q0 = 50mv note 10: definition is same as note 9 without power supply as follows. * 3v Q power supply <4 v note 11: dc signal output voltage is defined as follows. note 12: definition of dr v sat dr = v mdk v mdk is proportional to tint (integration time), so, the shorter tint condition makes wider dr. q0? tte= q1 q0 q0 q1 100 q0 q1? v os os free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 5 operating condition characteristics symbol min typ. max unit ?h? level 3.0 4.0 5.0 master clock pulse voltage ?l? level v ? 0 0 0.44 v (note 13) ?h? level 3.0 4.0 5.0 shift pulse voltage ?l? level v sh 0 0 0.44 v (note 13) ?h? level 3.0 4.0 5.0 icg pulse voltage ?l? level v icg 0 0 0.44 v (note 13) power supply voltage (digital) v dd 3.0 4.0 5.0 v (note 14) power supply voltage (analog) v ad 3.0 4.0 5.0 v (note 14) note 13 ?h? level of maximum pulse voltage = vdd vdd-0.5v = ?h? level of minimum pulse voltage. note 14 v ad = v dd clock characteristics (ta = 25c) ( 3.0v Q v ad = v dd Q 5.0v) characteristics symbol min typ. max unit master clock frequency f ? 0.4 2 4 mhz data rate f data 0.2 1 2 mhz master clock capacitance c ? ? 10 ? pf shift pulse capacitance c sh ? 200 ? pf icg pulse capacitance c icg ? 50 ? pf optical/electrical characteristics of page 3 are defined under the condition of 1mhz data rate. power- on characteristics ccd sensor has the characteri stics that a correct output signal will be appeared after power supply reached to regular voltage. it is required to 10 cycles of read out time at least after power supply reached to regular voltage. this characteristics should be considered, when circuit designs. free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 6 timing chart 1 t int (integration time) sh icg m 1 line r ead ou t pe r i o d 2 5 4 6 e l e m e n ts) dummy outputs (16 elements) light shield outputs (13 elements) (3 elements) dummy outputs (32 elements) signal outputs (2500 elements) dummy outputs 14 elements) os (output at s/h on) d45 d44 d43 d42 d41 d40 d37 d36 d35 d34 d33 d32 s2500 s2499 s2498 s2497 s2496 s4 s3 s2 s1 d31 d30 d29 d28 d27 d26 d25 d19 d18 d17 d16 d15 d14 d13 d3 d2 d1 d0 free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 7 timing chart 2 (use elect ric shutter function) sh icg tint (integration time) read out time m 1 line readout period 2546 elements ) dummy outputs (16 elements) light shield outputs (13 elements) (3 elements) dummy outputs (32 elements) signal outputs (2500 elements) dummy outputs 14 elements) os (output at s/h on) d45 d44 d43 d42 d41 d40 d37 d36 d35 d34 d33 d32 s2500 s2499 s2498 s2497 s2496 s4 s3 s2 s1 d31 d30 d29 d28 d27 d26 d25 d19 d18 d17 d16 d15 d14 d13 d3 d2 d1 d0 free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 8 timing requirements os characteristics symbol min typ. max unit icg pulse delay t1 1000 5000 ? ns pulse timing of icg and sh t2 100 500 1000 ns shift pulse width t3 1000 ? ? ns pulse timing of icg and m t4 0 20 ? ns * : to keep m ? high ? level when icg switch from ?low? to ?high? level. use electronic shutter pulse timing of sh and icg t3 ** *** *** *** **** ??????????? ** : each sh high pulse have to k eep always the same value with ? t3 ?. (t3 1000ns (min.)) *** : sh pulse cycle have to keep the same cycle (sh cycle period 10 s) except tint period. **** : tint 10 s (min.) note : the illumination of light source must be used with less than 1000 times based on 10ms t int. t4 t1 t2 t3 sh icg m sh icg read out time integration time (tint) free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 9 typical performance curves sensitivity response 0 50 100 150 200 33.544.55 power supply vad, vdd (v) sensitivity (v/lx.s ) free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 10 typical performance curves dc output voltage - power supply voltage 0 1 2 3 4 33.544.55 power supply vad, vdd (v) dc output voltage vos (v ) free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 11 typical drive circuit icg m nc 15 16 13 14 11 12 9 10 2 1 4 3 6 5 8 7 tcd 125 4 g fg ic1 : tc74ac04p r1 : 150 r2 : 2200 4.0v 0.1 f/25 v ic os 4v 10 f/25v r1 tr r1 vad ss os vdd nc nc sh m nc nc nc nc nc nc icg sh r2 free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 12 caution 1. electrostatic breakdown store in shorting clip or in conductive foam to avoi d electrostatic breakdown. ccd image sensor is protected against static electricity, but inferior puncture mode device due to static electricity is sometimes detected. in handing the devi ce, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate in crease of the manufacturing system due to static electricity. a. prevent the generation of static el ectricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. ground the tools such as soldering ir on, cutting pliers, tweezers or pincer. it is not necessarily required to execute al l precaution items for static electricity. it is all right to mitigate the precautions by conf irming that the trouble rate within the prescribed range. d. when the product is handed, please use tweezer s to avoid the damage of ccd image sensor. recommended tweezers is p-815 (hozan) or equivalent. e. ionized air is recommended for discharge when handling ccd image sensors. 2. incident light ccd sensor is sensitive to infrared light. note that infrared light component degrades resolution and prnu of ccd sensor. 3. ultrasonic cleaning ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as ccd because the bonding wires can become disconnected due to resonance during the cleaning process. 4. window glass protective tape the window glass protective tape is manufactured from materials in which static charges tend to build up. when removing the tape from ccd sensor after sold er mounting, install an ionizer to prevent the tape from being charged with static electricity. when the tape is removed, adhesives will remain in the glass surface. since th ese adhesives appear as black or white flaws on the image, please wipe the window glass surface with the cloth into which the organic solvent was infiltrated. then please attach ccd to a product. do not reuse the tape. free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 13 5. cleaning method of the window glass surface wiping cloth a. use soft cloth with a fine mesh. b. the wiping cloth must not cause dust from itself. c. use a clean wiping cloth necessarily. recommended wiping cloth is as follow; - mk cloth (toray industries) cleaner recommended cleaning liquid of window glass are as follow; - ee-3310 (olympus) when using solvents, such as alcohol, una voidably, it is cautious of the next. a. a clean thing with quick-drying. b. after liquid dries, there needs to be no residual substance. c. a thing safe for a human body. and, please observe the use term of a solvent and use the storage cont ainer of a solvent to be clean. be cautious of fire enough. way of cleaning first, the surface of window glass is wiped with the wiping cloth into which th e cleaner was infiltrated. please wipe down the surface of wind ow glass at least 2 times or more. next, the surface of window glass wipes with the dr y wiping cloth. please wipe down the surface of window glass at least 3 times or more. finally, blow cleaning is pe rformed by dry n2 filtered. if operator wipes the surface of the window glass wi th the above-mentioned proc ess and dirt still remains, toshiba recommends repeating the cl ean operation from the beginning. be cautious of the next thing. a. don't infiltrate the cleaner too much. b. a wiping portion is performed into the optical ra nge and don't touch the edge of window glass. c. be sure to wipe in a long direction and the same direction. d. a wiping cloth always uses an unused portion. wiper free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 14 the standard reflow condition for gl cc (surface mount device, pb-free) 1. storage precautions 1) do not drop or toss device packaging. the laminated aluminum material in it can be rendered ineffective by rough handling. 2) ensure packaging materials are stored in a 30 90%rh environment and do not store at the low temperature to prevent dew condensation. use de vices within 12 months; do not store them longer than that. 3) if the 30% humidity indicator is pink when the packaging is opened, bake the devices at 125 for 24 hours to remove any moisture present. devi ces should also be baked, whether still packed or not, if the effective usage peri od of the indicator has expires. 4) perform destructive prevention of the devi ces by static electricity in case of implementation of baking processing. 5) after opening the moiture-proof pack ing, store the products in the environment under 30 , and below 60%rh, and use them within 5 days. if the effective usage period passed after opening the moisture-proof pack ing, baking should be done before use at 125 for 24 hours. 6) ccd surface mount products may have a haze on the inside of glass, so be careful about folling. even if the haze arises inside of glass, when it is not on the pixel eria, there is no problem in quality. 2. mounting conditions using reflow 1) mounting method : (a) hot air reflows. (b) infrared ray reflow 2) preheating condition : 150 180 , 60 120 seconds 3) reflow condition : (a) maximum 240 (b) over 230 , within 30 50 seconds 4) heating times : only 1 time 5) caution : this product does not support a re-flow with pb-sn solder. pb-free solder should be used to re-flow with fig1?s profile. * the temperature profile is specified in terms of the temperature of top surface of the device. this temperature profile shows maximu m guaranteed device temperature. please set up the optimum temperature profile conditions within the fig.1 profile. fig.1 example of recommended temperature profile for reflows in addition, in case of the repair work accompanied by ic removal, since the degree of parallel may be spoiled with the left solder, please do not carry out. free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 15 3. mounting 1) in the case of solder mounting, the devices should be mounted with the window glass protective tape in order to avoid dust or dirt included in reflow machine. 2) the window glass protective tape is manufactu red from materials in which st atic charges tend to build up. when removing the tape from ccd sensor after so lder mounting, install an ionizer to prevent the tape from being charged wi th static electricity. 3) when the tape is removed, adhesives will remain in the glass surface. since th ese adhesives appear as black or white flaws on the image, please wipe the window glass surfac e with the cloth into which the organic solvent was infiltrated. then please attach ccd to a product. 4) do not reuse the window glass protective tape. 5) the parts of glass seal area have possibility to be became clouded by reflow process, however, there is no problem in quality.. 4. foot pattern on the pcb we recommend fig 2?s foot pattern for your pcb (printed circuit board). fig.2 5. mask for solder paste application we recommend metal mask that have the following thickness. ? a thickness of 0.1mm. and, we recommend that the size of the pattern of the metal mask is 100% of recommended foot pattern at fig. 2. free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 16 package dimensions free datasheet http://www..net/
TCD1254GFG rev. 3.0 2009-01-15 17 revision date description note 1.0 2008-6-23 new - 2.0 2008-12-25 modified: typical performance curve added: caution of storage - 3.0 2009-01-15 deleted: cautions of soft tray - restrictions on product use 060925eba_r6 ? the information contained herein is subject to change without notice. 021023_d ? toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their i nherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc. 021023_a ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. 021023_b ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_q ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringement s of patents or other rights of the third parties which may result from its use. no license is granted by implicat ion or otherwise under any patent or patent rights of toshiba or others. 021023_c ? please use this product in compliance with all applicable la ws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_af ? the products described in this document are subject to foreign exchange and foreign trade control laws. 060925_e free datasheet http://www..net/

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